Beschaffung eines semi-automatischen Wafer-Probersystems zur elektrischen und temperaturabhängigen Charakterisierung von 200 mm Wafern inklusive Installation und Integration.
- Contracting Authority
- IHP GmbH - Leibniz-Institut für innovative Mikroelektronik
- Location
- Brandenburg, Frankfurt (Oder)
- Submission deadline
- 13.10.2026
- Scope
- EU-wide
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Project Overview
Supply, delivery, installation, commissioning and integration of a semi-automatic wafer prober system for the electrical and temperature-dependent characterization of 200 mm wafers. The system shall support DC and pulsed I-V as well as low-frequency impedance measurements up to 10 MHz and shall be integrated with the existing Keithley 4200A-SCS characterization system. The scope includes the prober, temperature-controlled chuck (-60 °C to +300 °C), six electrical Kelvin probes, optical and camera systems, control hardware and software, cabling, installation, commissioning, and operator training.
Supply, delivery, installation, commissioning and integration of a semi-automatic wafer prober system for the electrical and temperature-dependent characterization of 200 mm wafers.
Project Location
Suitability & requirements
Bidder Requirements
- Eintragung in das Handelsregister
Technical details
Besondere Bedingungen
- Zahlungsbedingungen: 30% Anzahlung, 60% nach Lieferung, 10% nach Abnahme
- Elektronische Rechnungsstellung erforderlich
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Notice ID: 279074a6-1745-4fe1-814d-f709007498e7